Material used
FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics
FR4 Tg 150-180-200 – FR4 low Er and low Lf – Laminates Halogen Free

Base Thickness (Laminates inner)

75um – 100um – 200um – 250um – 330um – 400um – 510um – 600um – 750um – 900um – 1.1mm – 1.5mm – 1.9mm – 2.3mm

Prepreg (type)

106 – 1080 – 2125 – 7628

Thickness of base copper

12um – 18um – 35um – 70um – 105um – 140um – 170um – 210um

Spessore minimo pcb (with copper ext 18um and int 35um and inner minimum 0.1mm)
4L-> 0.4mm / 6L -> 0.7mm / 8L -> 1mm / 12L -> 1.4mm

Drilling
mechanics (minimum drill d=0.1mm), mechanical controlled height
laser via, blind and buried, for lay up sequential (HDI)

Surface Finishes
Passivated Copper – HAL Lead Free or Sn/Pb – Electrolytic gold
Immersion Gold(ENIG – ENIPIG – ASIG) – Silver or Immersion Tin

Go check Multilayer PCB in our online shop>>

PCB Multilayer - Alba PCB Group

Solder Resist

  • Definizion: Photographic (collimated light or laser direct imaging) – serigraphy ( occlusion holes)
  • Methodology of drafting: Silk Screen or Spray
  • Typical hardness : 6H
COLORS

Green, blue, red, white, black, transparent, some available in matte and glossy version.

Silk Screen

  • Methodology of drafting: Silk Screen or InkJet (only white)
  • Definizion: Serigraphy, Photographic, inkjet Pixel (720×720)
COLORS

White, Black, Blue, Yellow, Red.

Mechanical finish

FINISH OF THE BOARD
  • Single PCB
  • Panel PCB
  • Panel PCB with tap
  • Panel PCB with V-Scoring precuts
  • Mixed technology (Drilling and V-Scoring)

Opzional

WORK PROCESSES
  • Graphite printing (for sliding or membrane contacts)
  • Peelable solder resist printing
  • Print HTC insulating resins (epoxy and / or silicone)
  • Kapton taping
  • Controlled height machining: Drilling, Milling, Chamfering, Countersink, Boring
  • Occlusion holes (with solder resist or epoxy resins)

Laminates

  • FR4 Standard
  • FR4 medium / high / very highTG
  • Lead Free Epoxy material
  • Material (also fr4) low Er (high signal speed)
  • Material (also fr4) low Lf (low signal loss)
  • Polymide
  • Ptfe
  • Special Material (with filler Teflon or Ceramic)
  • Flexible Material (Du Pont, Krempel) or semi-flexible (Isola)
  • Halogen Free
  • Coverlay
  • IMS
  • Hybrids drive flex (fr4+polymide)
  • Hybrid drives (alta affidabilità termomeccanica e radio frequenza)
  • HTC Material (high thermal conductivity) for alta dissipazione
  • High CTI Material (max 600V)
  • Inlay or Cu-Coin embedded (for alta dissipazione)