{"id":1198,"date":"2019-06-24T11:42:50","date_gmt":"2019-06-24T09:42:50","guid":{"rendered":"http:\/\/albapcb.com\/uncategorized\/nuova-linea-shadow-per-una-metallizzazione-perfetta-di-microfori-e-fori-ciechi\/"},"modified":"2019-09-16T12:18:06","modified_gmt":"2019-09-16T10:18:06","slug":"the-new-shadow-line-for-a-perfect-metallization-of-micro-and-blind-holes","status":"publish","type":"post","link":"https:\/\/albapcb.com\/pl\/the-new-shadow-line-for-a-perfect-metallization-of-micro-and-blind-holes\/","title":{"rendered":"The new shadow line for a perfect metallization of micro- and blind holes"},"content":{"rendered":"<p>Fifteen meters of automatic horizontal line for removing all the impurities from the holes, making them conductive through the graphite deposit. A process that improves depositing the copper electrolytic in the holes thanks to the 30% increase in the spreading speed of the galvanic copper. A process that ensures a perfect metalizing.<\/p>\n<p>When drilling holes in the dielectric materials, the high temperature reached by the tools generates a residue of dissolved resin on the walls of the holes (smear). The first part of the new line removes this residue. Thus, within the line there is a homogeneous chemical process for the removal of any impurities present on the wall of the holes (de-smearing).<br \/>\nThe second part of the line deposits a thin layer of graphite (pre-metalizing shadow) on the walls of the hole just treated, by means of a forced pump process.<\/p>\n<p>The line allows for treating most types of PCBs (rigid, semi-flexible, HDI) made with different types of basic materials (standard FR4, medium and high TG, high CTI, Radio Frequency laminated). It permits a high level of productivity, bringing two exceptional advantages for each type of hole when compared to other metalizing processes:<\/p>\n<p>\u2022 Perfectly uniform final metalizing of micro-holes and blind holes, because the process ensures a greater spreading speed for the copper which is subsequently given a galvanic finish.<\/p>\n<p>\u2022 Increased reliability of multilayer electrical connections: the reduced graphite deposit requires a smaller micro-incision (less than 4 microns) and therefore a smaller retraction of the intermediate metal layers in the multilayer connections.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Fifteen meters of automatic horizontal line for removing all the impurities from the holes, making them conductive through the graphite deposit. A process that improves depositing the copper electrolytic in the holes thanks to the 30% increase in the spreading speed of the galvanic copper. A process that ensures a perfect metalizing. When drilling holes [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":897,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3],"tags":[],"class_list":["post-1198","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>The new shadow line for a perfect metallization of micro- and blind holes - ALBA PCB Group<\/title>\n<meta name=\"description\" content=\"Fifteen meters of automatic horizontal line for removing all the impurities from the holes, making them conductive through the graphite deposit...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/albapcb.com\/pl\/the-new-shadow-line-for-a-perfect-metallization-of-micro-and-blind-holes\/\" \/>\n<meta property=\"og:locale\" content=\"pl_PL\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"The new shadow line for a perfect metallization of micro- and blind holes - 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