PRODUCTOS
elaboraciones especiales
MATERIALS USED
CEM3 e FR4 HTC(High Thermal Conductivity)
BASE MATERIAL PRODUCERS
Panasonic – Nanya – Huazheng
TYPES OF PCBS
Single-face – Double face – Multi-layer (only with FR4)
THERMAL COEFFICIENT
0.8 – 1.0 – 1.2 W/m°K (with copper layers for dissipation)
RAME COPPER THICKNESS
18um – 35um – 70um (only FR4)
SURFACE FINISHINGS
Organic Solderability Preservative on copper –Lead Free HAL or Sn/Pb – Electrolytic Gilding – Chemical Gilding (ENIG – ENIPIG – ASIG) – Chemical Silver (Immersion or Electroless) or Tin ( Immersion)
Laminates
• FR4 HTC
• IMS (alluminium base)
• IMS (copper base)
• CEM3
• HTC (high thermal conductivity) materials for high dissipation
solder resist
• LPI inks (photographic)
• Epoxy inks (silkscreen printing)
• Flexible inks (for PCB flex, rigid flex and semi-flex)
• Definition: Photographic (collimated light or direct laser imaging) – Silkscreen printing (hole occlusion)
• Spreading methods: Silkscreen printing or Spray
• Typical hardness: 6H
COLOURS: Green, blue, red, white, black, yellow, grey and transparent.
*some are available in matte and glazed versions
silk screen
• Spreading methods: Silkscreen printing or Ink Jet (only white)
• Definition: Silkscreened printing, Photographic, inkjet Pixel (720×720)
COLOURS: White, Black, Blue, Yellow, Red and Grey
Mechanical finishing
FINISHING TYPES CARD:
• Single PCBs
• Panel-type PCBs
• Panel-type PCBs with indicators
• Electrical panel with pre-cut V-scoring
• Mixed technology (Milling and V-scoring)
Optionals
PROCESSING:
• Resistive Graphite printing (for sliding contacts)
• Conductive Graphite printing (for membrane contacts)
• Peel-off solder resist mask printing
• HTC insulating resin (epoxy and/or silicone) printing
• Kapton wrapping tape
• Controlled height machining: Drilling, Milling, Bevelling, V-shape flaring, Boring
• Hole occlusion (with solder resist or epoxy resins)
