PRODUCTS
Single and double-faced
MATERIALS USED
FR4 – CEM1 (only single-faced) – CEM3 –HTC Laminates (High Thermal Conductivity)
Polyimide (and/or Kapton) -Teflon – FR4 Tg 130-150-180-200 – Laminates with CTI>250 (PLC<3) – FR4 low Er (for RF) – FR4 ceramics –Halogen Free Laminates – FR4 high ductility (semi-flex)
LAMINATED BASE THICKNESS
(including copper when > 0.8mm)
0.1mm – 0.2mm – 0.3mm – 0.4mm – 0.6mm – 0.8mm – 1.0mm – 1.2mm – 1.6mm – 2.0mm – 2.4mm – 3.2 mm
COPPER BASE THICKNESS
12 um – 8um – 35um – 70um – 105um – 140um – 170um – 200um
SURFACE FINISHINGS
Organic Solderability Preservative on copper– Hot Air Levelling Lead Free or Sn/Pb 6337– Chemical Gilding (ENIG – ENIPIG – ASIG) – Electrolytical Gilding – Chemical Silver (Immersion or Electroless)– Chemical Tin (Immersion)
Laminates
• FR4 Standard
• FR4 medium/high/extra high TG
• Lead Free Epoxy-Materials
• Materials (even fr4) with low Er (high velocity signal)
• Materials (even fr4) with low Lf (low signal loss)
• Polyimide
• PTFE
• Special materials (with Teflon or Ceramic fillers)
• Flexible (Du Pont, Krempel) or semi-flexible (Isola) materials
• Halogen Free
• Coverlay
• IMS
• CEM1 (only single-face)
• CEM3
• HTC (high thermal conductivity) materials with high thermal conductibility
• Materials with high CTI (over 600V)
solder resist
LPI inks (photographic)
Epoxy inks (silkscreen printed)
Flexible inks (for PCB flex, rigid flex and semi-flex)
Definition: Photographic (collimated light or direct laser imaging) – silkscreen printing (hole occlusion)
Spreading methods: Silkscreen printing or Spray
Typical hardness: 6H
COLOURS: Green, blue, red, white, black, yellow, grey, and transparent.
*some are available in matte and glazed versions”
silk screen
Spreading methods: Silkscreen printing or Ink Jet (only white)
Definition: Serigraphic, Photographic, inkjet Pixel (720×720)
COLOURS: White, Black, Blue, Yellow, Red and Grey
Finishing
FINISHING TYPES CARD:
• Single PCBs
• Panel-type PCBs
• Panel-type PCBs with indicators
• Electrical panel with pre-cut V-scoring
• Mixed technology (Milling and V-scoring)
Optionals
PROCESSING:
• Resistive Graphite printing (for sliding contacts)
• Conductive Graphite printing (for membrane contacts)
• Peel-off solder resist mask printing
• HTC insulating resin (epoxy and/or silicone) printing
• Kapton wrapping tape
• Controlled height machining: Drilling, Milling, Bevelling, V-shape flaring, Boring
• Hole occlusion (with solder resist or epoxy resins)
