New line to promote perfect adhesion of the intermediate layers of a multilayer
The introduction of the new Copper Oxidation Line from Ocleppo is a choice that goes in the direction of continuous improvement of our production plant in Mogliano Veneto (Treviso – Italy).
The purpose of the plant is to clean the copper surface of the intermediate layers of a multilayer and chemically treat it to make it ‘less smooth’; the increased roughness serves to promote the adhesion and perfect hold of the prepreg (insulating layer positioned between one layer and another of a multilayer) during the pressing phase of the multilayer.
The strength of this bond is crucial for maintaining the integrity of a PCB when it is subjected to thermal stresses such as soldering in the future.
Not of secondary importance, in view of our philosophy of working towards an increasingly sustainable production plant, is the fact that the line is equipped with an automatic Stand By system that intervenes to reduce energy impact and water consumption.
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