Technical Data Sheets
HDI Microelectronics PCBs
HDI PCBs combine miniaturization and high performance. Their production at our Italian facility showcases our know-how and innovation capabilities. With cutting- edge technologies and advanced processes, we meet customer demands with state-of-the-art solutions in microelectronics.
MBB
Moisture Barrier Bag
The MBB is a packaging designed to protect its contents from both moisture and electrostatic discharge, another factor that can cause undesirable effects in EMS departments. It is a perfect solution when you want to be sure of almost absolute protection from moisture during transport and long-term storage.
Power & Thermal
management PCBs
The integration of “bus bars” or “coins” in printed circuits represents advanced and innovative technological solution that offers many advantages over traditional PCBs in terms of reliability, performance, space and overall cost of electronic devices.
Alba Semiflex
Alba SEMIFLEX technology is ideal for the direct, static, semi-flexible interconnection of two or more printed circuit boards (1 to 12 layers). It also replaces wiring, terminals, connectors or polyimide (PI).
HDI PCB - High Density Integration
HDI PCBs represent a technologically advanced solution that is essential for realising higher component density and interconnections. This makes it possible to reduce the size, improve performance and increase the reliability of modern electronic devices. Through the use of microvias, multilayer architectures and innovative materials, these PCBs are essential for high-density, high-speed applications.
Embedded Copper Coin (ECC)
Embedded Copper Coin (ECC) è una tecnologia in cui un inserto di rame solido è incorporato nello stackup del PCB al fine di ottenre un trasferimento termico ad altissima efficienza. Esso agisce come un ponte termico tra componenti ad alta potenza e i dissipatori di calore, riducendo la resistenza termica e migliorando l’affidabilità. Ideale per applicazioni ad alte prestazioni nei settori di elettronica di potenza, automotive e telecomunicazioni.
